Samsung may be changing course at the 11th hour – development of the Galaxy S27 Ultra is nearly complete, but now insiders are saying that the company will dual-source chipsets for the new flagship.
The original plan was for the S27 Ultra to use the top Snapdragon 8 Elite Gen 6 chip in all markets. However, following encouraging internal benchmarks, the Exynos 2700 has become a viable option for the 2027 flagship.
The insiders quoted by Korean publication MoneyToday claim that Samsung MX and LSI have coordinated to develop an Exynos-based motherboard for the S27 Ultra and to ensure a sufficient supply of the in-house chip.
By the sound of it, the Galaxy S27 Ultra will be subject to the same regional divisions as the other S27 members – US-bound units will still be powered by a Snapdragon chip, while Ultra phones for Korea and Europe will get the Exynos chip instead. Something like this hasn’t happened in years – the Galaxy S22 Ultra from 2022 was the last S Ultra to have an Exynos variant.
Samsung Galaxy S27 Ultra (CAD-based render)
“It is unusual for an Exynos version to be added when the major development process for Snapdragon was nearly complete. This signifies high expectations for the proprietary AP (Application Processor),” said one of the insiders.
The vanilla Galaxy S27, the S27+ and even the new S27 Pro will use a mix of Snapdragon and Exynos. The Exynos 2700 is fabbed on Samsung’s enhanced SF2P (2nm) node that promises a 26% power reduction and a 15% boost in clock speeds.
CAD-based renders of the Galaxy S27 Ultra show the new camera island design. The phone itself will be nearly the same size as the S26 Ultra, but it will bring a modest battery upgrade. Samsung is finally axing the 10MP 3x tele camera and will shore up the remaining 50MP 5x tele camera.
Source (in Korean)
